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RESEARCH INTERESTS

  • Physical design for 2.5D / 3D ICs.

  • Analog and mixed signal IC design.

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PROJECT

Jun. 2018

-  Present

RTL-to-GDS Tools and Methodologies for Sequential Integration Monolithic 3D ICs

(DARPA, 2018 - 22)

Aug. 2017

-  Aug. 2019

A Vertically-Integrated Design Flow for IP Reuse and Heterogeneous Integration

(DARPA, 2017 - 21)

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